I. Classification by Laser Type
1. CO₂ Laser Cutting Machines
Laser Type: Carbon dioxide gas laser (wavelength ~10.6μm)
Characteristics:
Material Compatibility: Excels in cutting non-metallic materials (e.g., acrylic, wood, fabric, leather, paper, glass) and thin metals (e.g., stainless steel, aluminum <3mm).
Power Range: Typically 50W–5,000W. High-power models can cut thick non-metals (e.g., 20mm+ acrylic) but have limited metal-cutting thickness.
Advantages: Mature technology, lower cost, smooth cutting surface for non-metals; relatively simple maintenance for gas lasers.
Disadvantages: Long wavelength leads to low metal absorption, inefficient for thick metal cutting; larger equipment size and higher energy consumption.
Applications: Advertising signage, textile processing, crafts, non-metal sheet manufacturing, etc.
2. Fiber Laser Cutting Machines
Laser Type: Fiber laser (wavelength ~1.06μm)
Characteristics:
Material Compatibility: Specialized in metal cutting (carbon steel, stainless steel, aluminum alloy, galvanized steel), ideal for medium-to-thick plates (carbon steel up to 40mm, stainless steel 20mm+).
Power Range: 200W–40,000W+. Low-power (<1,000W) for precise thin-plate cutting; high-power for fast thick-plate processing.
Advantages: High energy efficiency (30% vs. 10% for CO₂), low power consumption; excellent beam quality, 3–5x faster cutting speed than CO₂, high precision (±0.05mm); maintenance-free (long fiber lifespan, no lens wear).
Disadvantages: Poor performance on non-metals (low absorption in some materials); higher cost for high-power models.
Applications: Metal fabrication, sheet metal processing, construction machinery, automotive manufacturing, aerospace, etc.
3. UV Laser Cutting Machines (Ultraviolet Laser)
Laser Type: UV solid-state laser (wavelength 200–400nm, commonly 355nm)
Characteristics:
Material Compatibility: Suited for high-precision, brittle, or heat-sensitive materials (glass, ceramics, PCB boards, flexible circuits, plastic films, sapphire, silicon wafers).
Power Range: Typically 1–100W, focusing on low-power precision processing.
Advantages: Extremely short wavelength enables concentrated energy, "cold processing" with a heat-affected zone <10μm, avoiding thermal deformation; ultra-high precision (±0.01mm) with burr-free edges.
Disadvantages: Low power limits cutting thickness (<1mm typically); high equipment cost and complex maintenance.
Applications: Electronics component processing, semiconductor packaging, precision instruments, medical devices, micro-nano structure fabrication, etc.
4. Green Laser Cutting Machines (532nm Laser)
Laser Type: Solid-state laser (wavelength 532nm, via Nd:YAG frequency doubling)
Characteristics:
Material Compatibility: Bridges infrared (fiber/CO₂) and UV lasers, suitable for translucent or highly reflective materials (plastics, plexiglass, coated metals, ceramic tiles, lithium battery electrodes).
Power Range: 10–200W, for mid-low power precision processing.
Advantages: Smaller heat-affected zone than CO₂/fiber lasers; better material absorption than UV for some applications, balancing precision and efficiency.
Disadvantages: Limited power (<2mm cutting thickness typically); higher cost than fiber lasers.
Applications: Lithium battery manufacturing, electronic component cutting, precision plastic processing, solar cell slicing, etc.
5. Ultra-Fast Laser Cutting Machines (Femtosecond/Picosecond Laser)
Laser Type: Ultra-short pulse lasers (pulse width: femtosecond 10⁻¹⁵s/picosecond 10⁻¹²s)
Characteristics:
Material Compatibility: Suitable for almost all materials, especially difficult-to-process ones (diamond, silicon carbide, glass wafers, semiconductor chips).
Power Range: Typically 1–50W, focusing on ultra-precision micro-processing.
Advantages: Extremely short pulses generate peak energy for "multiphoton absorption," enabling thermal-damage-free cutting with micron-level precision and ultra-smooth surfaces.
Disadvantages: Extremely high cost (millions of dollars), slow processing speed; limited to research or high-end industrial use.
Applications: Semiconductor wafer cutting, MEMS device processing, optical lens micro-structuring, biomedical precision components, etc.
II. Classification by Structure and Function (Supplementary)
Benchtop Laser Cutters: Compact, low-power (<100W), ideal for labs, maker spaces, or small-scale processing (e.g., acrylic models, leather engraving).
Gantry Laser Cutters: Large-scale, high-power machines for cutting large-format metal/non-metal sheets, the mainstream in industrial settings.
Cantilever Laser Cutters: Compact structure for medium-format processing, balancing flexibility and stability.
3D Laser Cutters: Equipped with 5-axis 联动 systems, capable of cutting curved or three-dimensional workpieces (e.g., automotive panel molds, aerospace complex components).
Summary: How to Choose?
Metal Cutting (especially medium-to-thick plates): Prioritize fiber laser cutters.
Non-Metal/Thin Metal Precision Processing: Choose CO₂ laser cutters (cost-effective) or UV/green laser cutters (high-precision needs).
Ultra-Precision Micro-Processing/Brittle Materials: Opt for ultra-fast (femtosecond/picosecond) laser cutters.
Large-Format Industrial Production: Select gantry-style fiber/CO₂ laser cutters.